830 Tie Points Transparent Solderless Breadboard


Price:
S$5.50
Stock:
In stock (5 units), ready to be shipped

Description

830 Tie Points Transparent Solderless Breadboard

Standard Hole Spacing: 2.54mm (0.1 inch)
Dimensions: 165 x 54 x 8.5mm
Weight: 80g
Max Voltage: 300V
Max Current: 3-5A
Wire Size: 20-29AWG

Note:
- 2 power lanes, 200 tie points
- 1 double strip, 630 tie points
- prototype-friendly
- no need for soldering
- double-sided tape at the bottom
- has interlocking parts to join multiple breadboards together

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